US Patent Issued to AUTONETWORKS TECHNOLOGIES, SUMITOMO WIRING SYSTEMS, SUMITOMO ELECTRIC INDUSTRIE on Dec. 23 for "Wiring module" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,227, issued on Dec. 23, was assigned to AUTONETWORKS TECHNOLOGIES LTD. (Mie, Japan), SUMITOMO WIRING SYSTEMS LTD. (Mie, Japan) and SUMITOMO ELECTRIC INDUSTRIE LTD. (Osaka, Japan).

"Wiring module" was invented by Naoki Fukushima (Mie, Japan), Osamu Nakayama (Mie, Japan), Katsushi Miyazaki (Mie, Japan) and Mitsutoshi Morita (Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring module is attached to a plurality of power storage elements, and includes: a flexible printed circuit board; and a protector holding the flexible printed circuit board, wherein the flexible printed circuit board includes a base film, a plurality of conduction paths...