ALEXANDRIA, Va., May 5 -- United States Patent no. 12,621,955, issued on May 5, was assigned to AURAS TECHNOLOGY Co. LTD. (New Taipei City, Taiwan).

"Heat dissipation device" was invented by Chih-Wei Chen (New Taipei City, Taiwan), Kang-Ming Fan (New Taipei City, Taiwan), Tsung-Han Tsai (New Taipei City, Taiwan), Fu-Hsuan Hsieh (New Taipei City, Taiwan) and Chien-Yu Liu (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation device includes an inclined heat pipe and a plurality of inclined heat dissipation fins. The inclined heat pipe includes an inclined heat dissipation area, and each inclined heat dissipation fin includes an inclined heat dissipation portion. In addition...