US Patent Issued to AUO on July 28 for "Light emitting diode package structure, manufacturing method of light emitting diode package structure and light emitting panel" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,599, issued on July 28, was assigned to AUO Corp. (Hsinchu City, Taiwan).

"Light emitting diode package structure, manufacturing method of light emitting diode package structure and light emitting panel" was invented by Shuo-Yang Sun (Hsinchu, Taiwan), Hao-Lun Hsieh (Hsinchu, Taiwan), Xiao-Yun Li (Hsinchu, Taiwan), Yu-Hao Chang (Hsinchu, Taiwan), Fu-Yang Chen (Hsinchu, Taiwan), Jhih-Jhu Jhan (Hsinchu, Taiwan), Yu-Chih Wang (Hsinchu, Taiwan) and Ying-Hui Lai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light emitting diode (LED) package structure includes a first insulating layer, a first conductive pattern, a second insulating l...