US Patent Issued to ATI TECHNOLOGIES, ADVANCED MICRO DEVICES on Sept. 15 for "Multi-die system performance optimization" (American, Canadian Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,737,024, issued on Sept. 15, was assigned to ATI TECHNOLOGIES ULC (Markham, Canada) and ADVANCED MICRO DEVICES INC. (Santa Clara, Calif.).

"Multi-die system performance optimization" was invented by Greg Sadowski (Boxborough, Mass.), Sriram Sundaram (Austin, Texas), Stephen Kushnir (Markham, Canada), William C. Brantley (Austin, Texas) and Michael J. Schulte (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-die semiconductor package includes a first integrated circuit (IC) die having a first intrinsic performance level and a second IC die having a second intrinsic performance level different from the first intrinsic performance leve...