US Patent Issued to AT&S Austria Technologie & Systemtechnik on Nov. 4 for "Component carrier with surface mounted components connected by high density connection region" (Austrian Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,124, issued on Nov. 4, was assigned to AT&S Austria Technologie & Systemtechnik AG (Leoben, Australia).

"Component carrier with surface mounted components connected by high density connection region" was invented by Markus Leitgeb (Trofaiach, Austria) and Gerhard Freydl (Leoben, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "A component carrier includes a stack with electrically conductive layer structures and at least one electrically insulating layer structure. The electrically conductive layer structures have a higher density connection region and a lower density connection region, and a first component and a second component which are sur...