ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,661, issued on Aug. 4, was assigned to AT&S Austria Technologie & Systemtechnik AG (Leoben, Austria).

"Component carrier with connected component having redistribution layer at main surface" was invented by Artan Baftiri (Chongqing, China) and Jeesoo Mok (Chongqing, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A component carrier includes a stack including at least one electrically conductive layer structure and at least one electrically insulating layer structure and a component connected to the stack. The component has a planar redistribution layer at a main surface thereof."

The patent was filed on Jan. 18, 2023, under Application No. 18/...