ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,937, issued on Aug. 18, was assigned to AT&S (Chongqing) Co. Ltd. (Chongqing, China).

"Component carrier and method of manufacturing the same" was invented by Jeesoo Mok (Chongqing, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A component carrier includes an inorganic layer structure having a first main surface and a second main surface; a first electrically insulating layer structure applied on the first main surface of the inorganic layer structure; a first electrically conductive layer structure applied on the first electrically insulating layer structure; and at least one inner hole extending through the inorganic layer structure and the...