US Patent Issued to AT&S (China) on Dec. 2 for "Component carrier with asymmetric build-up and methods for determining a design of and manufacturing the same" (Singaporean, Finnish, Italian Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,376, issued on Dec. 2, was assigned to AT&S (China) Co. Ltd. (Shanghai).

"Component carrier with asymmetric build-up and methods for determining a design of and manufacturing the same" was invented by Diego Lorenzoni (Novara, Italy), Mikael Andreas Tuominen (Pernio, Finland) and Seok Kim Tay (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A component carrier with an asymmetric build-up, which includes (a) a core; (b) a first stack at a first main surface of the core, the first stack having at least one first electrically conductive layer structure and a plurality of first electrically insulating layer structures; and (c) a second stack at a...