US Patent Issued to ASUSTek COMPUTER on Oct. 20 for "Heat dissipation module" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,371, issued on Oct. 20, was assigned to ASUSTek COMPUTER INC. (Taipei City, Taiwan).

"Heat dissipation module" was invented by Po-Ting Chen (Taipei City, Taiwan), Chang-Hung Chen (Taipei City, Taiwan) and Chih-Hung Chuang (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation module is adapted to be installed on a motherboard having a connector. The connector is adapted to connect an interface card. The heat dissipation module includes a base assembly adapted to be fixed on the motherboard, a heat dissipation member, and a fastening member. The base assembly is an integrated base body having opposite first and second ...