US Patent Issued to ASUSTEK COMPUTER on May 13 for "Mold assembly for assembling touch module in housing and assembling method using the same" (Taiwanese Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,298,821, issued on May 13, was assigned to ASUSTEK COMPUTER INC. (Taipei, Taiwan).

"Mold assembly for assembling touch module in housing and assembling method using the same" was invented by Kuan-Yu Lin (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A mold assembly for assembling a touch module in a housing is provided. The touch module comprises a carrier, a circuit board, and a touch film. The housing has an opening corresponding to the touch module, and there has a plurality of positioning elements and a plurality of securing elements around the opening. The mold assembly comprises a base, a first frame, and a second frame. The base h...