US Patent Issued to ASUSTeK COMPUTER on July 21 for "Loop heat pipe with barrier body in condensation section" (Taiwanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,687,345, issued on July 21, was assigned to ASUSTeK COMPUTER INC. (Taipei City, Taiwan).

"Loop heat pipe with barrier body in condensation section" was invented by Ing-Jer Chiou (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A loop type heat dissipation structure includes a heat pipe, a communicating pipe, and working fluid. The heat pipe includes a pipeline, a capillary structure, and a first barrier body. The pipeline has a first evaporation section, a first condensation section, an outlet, and an inlet. The outlet is located at an edge of the first evaporation section, and the inlet is located at an edge of the first condensation...