US Patent Issued to ASUSTeK COMPUTER on Feb. 10 for "Heat dissipation module" (Taiwanese Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,289, issued on Feb. 10, was assigned to ASUSTeK COMPUTER INC. (Taipei, Taiwan).

"Heat dissipation module" was invented by Ing-Jer Chiou (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation module adapted for an electronic device with a fan is provided. The heat dissipation module includes a vapor chamber and a communicating pipe. The vapor chamber has a first cavity having an evaporating area and a second cavity communicated with the first cavity. The communicating pipe includes a first pipe and a second pipe communicated with the first pipe, wherein the first pipe is communicated with the first cavity, and the second pi...