ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,339, issued on Dec. 23, was assigned to ASUSTeK COMPUTER INC. (Taipei, Taiwan).
"Heat dissipation module" was invented by Kuan-Chuan Wang (Taipei, Taiwan), Yi-Hong Lin (Taipei, Taiwan), Chin-Chuan Wu (Taipei, Taiwan) and Wei-Chia Liao (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation module is adapted for being installed on a circuit board. The heat dissipation module includes a fixed base and a heat dissipating device. One end of the fixed base is adapted for being fixed to the circuit board, and the other end has a rotating component. The rotating component is pivoted on the fixed base along a rotation axis. The hea...