ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,611, issued on Sept. 22, was assigned to ASM IP Holding B.V. (Almere, Netherlands).

"Substrate processing method and apparatus" was invented by Akinori Nakano (Tokyo), Toshihisa Nozawa (Tokyo) and Ryu Nakano (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a substrate processing apparatus and a substrate processing method capable of achieving uniform trimming throughout an entire surface of a substrate. The substrate processing apparatus includes a gas channel including a center gas inlet and an additional gas inlet spaced apart from the center gas inlet, and a shower plate including a plurality of holes connected to the center ga...