US Patent Issued to ASM IP Holding on Oct. 20 for "Methods of filling trenches on substrate surface" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,760, issued on Oct. 20, was assigned to ASM IP Holding B.V. (Almere, Netherlands).

"Methods of filling trenches on substrate surface" was invented by Alexey Remnev (Kawasaki, Japan), Takahiro Kawashima (Inagi, Japan), Frank Wilson Amalraj (Tama, Japan) and Tamal Saha (Machida, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of filling trenches on a surface of a substrate is provided. The method may comprise comprises the steps of providing a substrate within a reaction chamber, the substrate comprising a plurality of narrow trenches and wide trenches formed on a surface of the substrate; a 1st deposition step comprising: (a) flowing a ...