US Patent Issued to ASM IP Holding on Feb. 17 for "Thermal break between a substrate processing chamber and substrate handling chamber" (Arizona Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,553,523, issued on Feb. 17, was assigned to ASM IP Holding B.V. (Almere, Netherlands).

"Thermal break between a substrate processing chamber and substrate handling chamber" was invented by Mandar Deshpande (Phoenix), Senthil Arasu Subas Chandra Bose (Chandler, Ariz.) and Samer Banna (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "Thermal breaks and/or gaps between portions of interfacing surfaces of two chambers reduce heat transfer between the chambers. An interface surface (e.g., of a gate valve) includes (i) a base surface; (ii) a raised ring surface extending outward beyond the base surface, wherein the raised ring surface extends around a g...