ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,638, issued on Feb. 10, was assigned to ASM IP Holding B.V. (Almere, Netherlands).
"Substrate processing method" was invented by SungHa Choi (Suwon-si, South Korea), HongSuk Kim (Yongin-si, South Korea), KiHun Kim (Yongin-si, South Korea), SangHeon Yong (Yongin-si, South Korea) and JuHyuk Park (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of processing a substrate having a gap includes loading the substrate onto a substrate support unit, supplying an oligomeric silicon precursor and a nitrogen-containing gas to the substrate through a gas supply unit on the substrate support unit, and generating a direct plasma in...