ALEXANDRIA, Va., March 3 -- United States Patent no. 12,565,705, issued on March 3, was assigned to ASKA Corp. (Fukuoka, Japan).
"Electroless plating apparatus" was invented by Takayuki Furusawa (Fukuoka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electroless plating apparatus includes: a plating bath; a reserve tank; a retaining means for retaining a plurality of semiconductor wafers upright at regular intervals; a plating liquid circulating path; a circulating pump; a flowmeter and a plating liquid supply pipe having a plurality of spouts formed in an upper part thereof at regular intervals. The regular intervals at which the plurality of semiconductor wafers are retained upright by the retain...