US Patent Issued to ASICS on March 3 for "Cutting support apparatus, cutting pattern generation method, and cutting system" (Japanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,424, issued on March 3, was assigned to ASICS Corp. (Kobe, Japan).

"Cutting support apparatus, cutting pattern generation method, and cutting system" was invented by Yuya Kozuka (Kobe, Japan), Genki Hatano (Kobe, Japan), Naoto Iwashita (Kobe, Japan), Shingo Takashima (Kobe, Japan) and Shinsaku Wakasugi (Kobe, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cutting support apparatus includes an input unit that receives shoe last data, a storage in which a shape and a type of a plurality of plate-like parts are stored, a processor that generates a cutting pattern for cutting the plurality of plate-like parts from a plate-like member having a pr...