ALEXANDRIA, Va., April 15 -- United States Patent no. 12,600,077, issued on April 14, was assigned to ASANO LAB CO LTD (Togo-cho, Japan).
"Thermoforming device" was invented by Kazushi Hayashi (Miyoshi, Japan), Yasushi Oguma (Kitanagoya, Japan) and Norifumi Asao (Nagoya, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thermoforming device performs a heating process of radiationally heating a resin film to a predetermined temperature by a radiation heater and a bonding process of bonding the radiationally heated resin film to a pulp mold set on a base. The thermoforming device includes a vacuum pump to evacuate a space between the pulp mold and the resin film to bring the resin film to be in close cont...