US Patent Issued to ARRAYED MATERIALS (CHINA) on June 23 for "Magnetron sputtering apparatus and control method for timely detecting target shorting by monitoring electrical resistance between PVD target cathode and electrical ground in real time" (Chinese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,662,732, issued on June 23, was assigned to ARRAYED MATERIALS (CHINA) Co. LTD. (Shenzhen, China).

"Magnetron sputtering apparatus and control method for timely detecting target shorting by monitoring electrical resistance between PVD target cathode and electrical ground in real time" was invented by Hong Sheng Yang (Shenzhen, China), Min Luo (Shenzhen, China), Zuoxing Li (Shenzhen, China) and Xiaojun Zhang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus, method, and computer-readable storage medium for magnetron sputtering for thin film deposition. The apparatus may include a chamber for thin film deposition, configured to h...