US Patent Issued to Arkray on Aug. 4 for "Specimen analysis apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. D1,140,081, issued on Aug. 4, was assigned to Arkray Inc. (Kyoto, Japan).

"Specimen analysis apparatus" was invented by Kenya Hara (Tokyo), Chiyong Kim (Chiba, Japan) and Kanako Ohashi (Tokyo).

The patent was filed on Aug. 22, 2024, under Application No. D/958,886.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1140081&OS=D1140081&RS=D1140081

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