US Patent Issued to ARIECA on Aug. 4 for "Methods and systems for generating a bond line parameter of a circuit assembly, and methods of manufacture of a circuit assembly" (Pennsylvania Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,700,119, issued on Aug. 4, was assigned to ARIECA INC. (Pittsburgh).

"Methods and systems for generating a bond line parameter of a circuit assembly, and methods of manufacture of a circuit assembly" was invented by Loren Russell (Pittsburgh), Dylan S. Shah (Pittsburgh) and Navid Kazem (Pittsburgh).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and systems for generating a bond line parameter of a circuit assembly, and methods of manufacture of a circuit assembly are provided. The method comprises capturing, by a sensor, third three-dimensional data of the circuit assembly. The third three-dimensional data corresponds to a first region of a first ...