US Patent Issued to ARAKAWA CHEMICAL INDUSTRIES on Dec. 23 for "Curable photosensitive resin composition, cured product, resist pattern, method of producing resist pattern, semiconductor device and electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,504,687, issued on Dec. 23, was assigned to ARAKAWA CHEMICAL INDUSTRIES LTD. (Osaka, Japan).

"Curable photosensitive resin composition, cured product, resist pattern, method of producing resist pattern, semiconductor device and electronic device" was invented by Takashi Yamaguchi (Osaka, Japan), Taiyou Nakamura (Osaka, Japan), Atsushi Shiotani (Osaka, Japan), Keisuke Sugimoto (Osaka, Japan), Madoka Yamashita (Osaka, Japan) and Takashi Tasaki (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A curable photosensitive resin composition which can be cured at a relatively low temperature, has excellent developability and adhesion to a support, and...