ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,770,813, issued on Oct. 20, was assigned to Aptiv Technologies AG (Schaffhausen, Switzerland).
"Solid state relay module" was invented by Jamie Mleczko (Oxford, Mich.), Cheuk Ng (Troy, Mich.) and Yu Li (Troy, Mich.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A solid state relay (SSR) module may include a first solid state switch configured to establish and break an electrical connection between an input terminal and an output terminal. The module includes an electronic controller configured to turn the first solid state switch on or off and a top cover formed of an electrically insulative thermoplastic material. The power circuit board is disposed wi...