ALEXANDRIA, Va., July 14 -- United States Patent no. D1,134,345, issued on July 14, was assigned to Aptiv Technologies AG (Schaffhausen, Switzerland).
"Electronic module housing" was invented by Timothy Alan Suda (Avon, Ind.) and Tobias Richter-Brockmann (Dusseldorf, Germany).
The patent was filed on Aug. 13, 2024, under Application No. D/957,350.
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