ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,560,551, issued on Feb. 24, was assigned to Aptiv Technologies AG (Schaffhausen, Switzerland).
"Sensor housing for a sensor module" was invented by Pawel Szuba (Cracow, Poland) and Jakub Malina (Cracow, Poland).
According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor housing for a sensor module. The sensor housing includes an insulated internal volume and a thermal electric device. The insulated internal volume is configured for accommodating the sensor module therein. The thermal electric device is configured for alternatively heating and cooling the internal volume and/or the sensor module."
The patent was filed on May 17, 2024, under Application No. 1...