US Patent Issued to Apt Asia Pacific on Sept. 29 for "Payment structure with PCM material" (Australian Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,367, issued on Sept. 29, was assigned to Apt Asia Pacific Pty Ltd. (Victoria, Australia).

"Payment structure with PCM material" was invented by James Michael Tritt (Beaconsfield, Australia), Robert Corbo (Cranbourne North, Australia) and Sumeet Luddu (Chirnside Park, Australia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A floor pavement structure exhibiting resistance to overheating, the floor pavement structure comprising at least one layer containing a phase change material. The floor pavement structure may further comprise a heat conductive sub-layer including graphite, graphene or combinations thereof, the heat conductive sub-layer being dis...