US Patent Issued to Applied Materials on Sept. 29 for "Splitter circuit for wafer processing system" (California Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,749,655, issued on Sept. 29, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Splitter circuit for wafer processing system" was invented by Edward P. Hammond IV (Hillsborough, Calif.), David Coumou (Santa Clara, Calif.) and Upendra Ummethala (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure describes a semiconductor wafer processing system that uses a splitter circuit to delivery RF power from a power supply to multiple process chambers. The wafer processing system includes a first process chamber, a second process chamber, a power supply, a match circuit, and a splitter circuit. The power supply p...