ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,615, issued on Sept. 22, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"Isolation module formation for backside power delivery application" was invented by Veeraraghavan S. Basker (Fremont, Calif.), Kyoung Ha Kim (Cupertino, Calif.) and Byeong Chan Lee (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices and methods of manufacturing the same are described. The method includes combining selective recess of a sacrificial layer and isotropic etching of a silicon layer in order to form a protective cap that will allow the silicon layer of the substrate to be etched without affecting the sacrificial laye...