US Patent Issued to Applied Materials on Sept. 1 for "Particle reduction in physical vapor deposition of amorphous silicon" (California Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,723,304, issued on Sept. 1, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Particle reduction in physical vapor deposition of amorphous silicon" was invented by Peijiao Fang (Sunnyvale, Calif.), Mingdong Li (Santa Clara, Calif.) and Chengyu Liu (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods for depositing amorphous silicon films via physical vapor deposition processes are disclosed. In some embodiments, a method of depositing amorphous silicon in a physical vapor deposition (PVD) process chamber includes (a) depositing an amorphous silicon layer atop a surface of a substrate disposed on a substrate support via a...