US Patent Issued to Applied Materials on Sept. 1 for "In-situ carbon liner for high aspect ratio features" (American, French Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,409, issued on Sept. 1, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"In-situ carbon liner for high aspect ratio features" was invented by Hailong Zhou (San Jose, Calif.), Iljo Kwak (Santa Clara, Calif.), Olivier P. Joubert (Meylan, France) and Yu Wen (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Exemplary methods of semiconductor processing may include etching a first portion of a feature in a substrate disposed within a processing region of a semiconductor processing chamber. The first portion of the feature may at least partially extend through one or more layers of material formed on the substrate. The methods...