US Patent Issued to Applied Materials on Oct. 27 for "Method for forming high density carbon films with reduced substrate backside damage" (California Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,774,518, issued on Oct. 27, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Method for forming high density carbon films with reduced substrate backside damage" was invented by Dan Zhu (Santa Clara, Calif.), Thilini Ekanayaka (Santa Clara, Calif.), Ruiyun Huang (Santa Clara, Calif.), Yuxing Zhang (Santa Clara, Calif.), Jun Feng (Santa Clara, Calif.), Abhijit Kangude (Fremont, Calif.) and Xinhai Han (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a method for processing a substrate is provided. The method includes flowing a processing gas comprising a hydrocarbon precursor gas into a processing volume ...