ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,770,840, issued on Oct. 20, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"Electrostatic chuck assembly" was invented by Jaeyong Cho (San Jose, Calif.), Rajinder Dhindsa (Pleasanton, Calif.), Daniel Sang Byun (Campbell, Calif.) and Vladimir Knyazik (Santa Clara, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Examples of a substrate support assembly are provided herein. In some examples, the substrate support assembly has a ceramic electrostatic chuck having a first side configured to support a substrate and a second side opposite the first side, wherein the ceramic electrostatic chuck includes an electrode embedded in the ceramic ...