ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,363, issued on March 31, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"Apparatus for single chamber deposition and etch" was invented by Joseph AuBuchon (San Jose, Calif.), Philip A. Kraus (San Jose, Calif.), Thai Cheng Chua (Cupertino, Calif.), James Carducci (Sunnyvale, Calif.), Hanhong Chen (Milpitas, Calif.), Zhejun Zhang (Santa Clara, Calif.), Hao Zhang (Newark, Calif.) and Xiankai Yu (Sunnyvale, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Methods for filling a substrate feature with a seamless dielectric gap fill are described. Methods comprise sequentially depositing a film with a seam and partially etching the fil...