ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,803, issued on March 3, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"Methods of forming interconnect structures" was invented by Muthukumar Kaliappan (Fremont, Calif.), Bhaskar Jyoti Bhuyan (San Jose, Calif.), Yong Jin Kim (Albany, Calif.), Carmen Leal Cervantes (Mountain View, Calif.), Xiangjin Xie (Fremont, Calif.), Jesus Candelario Mendoza-Gutierrez (San Jose, Calif.), Aaron Dangerfield (San Jose, Calif.), Michael Haverty (Mountain View, Calif.), Mark Saly (Santa Clara, Calif.) and Kevin Kashefi (San Ramon, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Methods of forming semiconductor devices by enhancing selective depos...