US Patent Issued to Applied Materials on March 3 for "Method of isolating the chamber volume to process volume with internal wafer transfer capability" (American, Indian Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,567,565, issued on March 3, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Method of isolating the chamber volume to process volume with internal wafer transfer capability" was invented by Saravanakumar Natarajan (Coimbatore, India) and Ryan Pakulski (Brentwood, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a lid plate seated on the chamber body. The lid plate may define a plurality of apertures. The systems may include a plurality of lid stacks. The systems may include a plurality of substrate supports. The syste...