US Patent Issued to APPLIED MATERIALS on March 3 for "Lower edge ring of a process kit for semiconductor substrate processing" (Canadian, American Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. D1,115,720, issued on March 3, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.).

"Lower edge ring of a process kit for semiconductor substrate processing" was invented by Muhannad Mustafa (Santa Clara, Calif.), Muhammad M. Rasheed (San Jose, Calif.), Yu Lei (Belmont, Canada), Avgerinos V. Gelatos (Redwood City, Calif.), Vikash Banthia (Los Altos, Calif.), Victor H. Calderon (Sunnyvale, Calif.), Shi Wei Toh (Sunnyvale, Calif.), Yung-Hsin Lee (San Jose, Calif.) and Anindita Sen (San Jose, Calif.).

The patent was filed on July 11, 2022, under Application No. D/845,736.

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