US Patent Issued to Applied Materials on March 3 for "Chamber and methods of cooling a substrate after baking" (American, Indian Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,381, issued on March 3, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Chamber and methods of cooling a substrate after baking" was invented by Dmitry Lubomirsky (Cupertino, Calif.), Douglas A. Buchberger Jr. (Livermore, Calif.), Hyunjun Kim (Campbell, Calif.), Alan L. Tso (San Jose, Calif.), Shekhar Athani (Bangalore, India), Qiwei Liang (Fremont, Calif.) and Ellie Y. Yieh (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method and apparatus for performing post-exposure bake cooling operations is described herein. The method begins by post exposure baking a substrate disposed on heated substrate support in a proces...