US Patent Issued to Applied Materials on March 24 for "Substrate support assembly with multiple discs" (Texas, California Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,583,211, issued on March 24, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Substrate support assembly with multiple discs" was invented by Arvinder Manmohan Singh Chadha (San Jose, Calif.) and Chad Eric Mair (Dripping Springs, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for bonding components of an electrostatic chuck includes applying a first melting point depressing layer (MDL) to a bottom surface of a first puck plate including one or more functional elements of an electrostatic chuck. A second MDL is applied to a top surface of a second puck plate including one or more functional elements of the electrostatic chuc...