US Patent Issued to Applied Materials on March 24 for "Grain structure engineering for metal gapfill materials" (Singaporean, American, Indian Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,533, issued on March 24, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Grain structure engineering for metal gapfill materials" was invented by Prayudi Lianto (Singapore), Marvin Louis Bernt (Whitefish, Mont.), Tapash Chakraborty (Dombivali, India), Yin Wei Lim (Singapore) and Jing Xu (Kalispell, Mont.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for depositing copper onto a substrate includes grain engineering to control the internal structure of the copper. In some embodiments, the method comprises depositing a grain control layer conformally onto a copper seed layer in a structure on the substrate where the grain cont...