US Patent Issued to Applied Materials on March 17 for "Electrostatic chuck assembly for high temperature processes" (California Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. RE50,838, issued on March 17, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Electrostatic chuck assembly for high temperature processes" was invented by Vijay D. Parkhe (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrostatic chuck assembly includes a puck and a cooling plate. The puck includes an electrically insulative upper puck plate comprising one or more heating elements and one or more electrodes to electrostatically secure a substrate and further includes a lower puck plate bonded to the upper puck plate by a metal bond, the lower puck plate comprising a plurality of features distributed over a bottom side...