US Patent Issued to Applied Materials on June 9 for "Delayed pulsing for plasma processing of wafers" (California Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,973, issued on June 9, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Delayed pulsing for plasma processing of wafers" was invented by Akhil Mehrotra (Sunnyvale, Calif.), Vinay Shankar Vidyarthi (San Jose, Calif.), Daksh Agarwal (Sunnyvale, Calif.), Samaneh Sadighi (San Jose, Calif.), Jason Kenney (Santa Clara, Calif.) and Rajinder Dhindsa (Pleasanton, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method, apparatus and system for processing a wafer in a plasma chamber system, which includes at least a plasma generating element and a biasing electrode, include generating a plasma in the plasma chamber system by applying a sou...