US Patent Issued to Applied Materials on June 23 for "Process chamber and process kits for advanced packaging" (American, Indian Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,665,166, issued on June 23, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Process chamber and process kits for advanced packaging" was invented by Aravind Miyar Kamath (San Jose, Calif.), Cheng-Hsiung Matthew Tsai (Cupertino, Calif.) and Manjunatha Koppa (Karnataka, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Process kits for processing chambers and processing chambers having a lower shield and lower shield ring are described. The lower shield has a ring-shaped body with an inner wall and an outer wall, a top wall and a bottom wall with an outer ledge wall extends outwardly from a lower portion of the outer wall to an outer led...