US Patent Issued to Applied Materials on June 2 for "Substrate support for a substrate processing chamber" (American, Japanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. D1,128,616, issued on June 2, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Substrate support for a substrate processing chamber" was invented by Zhixiu Liang (Fremont, Calif.), Michael Sterling Jackson (Sunnyvale, Calif.), Jiang Lu (Milpitas, Calif.), Cheng-Hsiung Matthew Tsai (Cupertino, Calif.), Tomoharu Matsushita (Chiba, Japan) and Zubin Huang (Santa Clara, Calif.).

The patent was filed on Dec. 23, 2024, under Application No. D/980,204.

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