US Patent Issued to APPLIED MATERIALS on July 14 for "Selective cobalt deposition on copper surfaces" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,680,158, issued on July 14, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.).

"Selective cobalt deposition on copper surfaces" was invented by Sang-Ho Yu (Cupertino, Calif.), Kevin Moraes (Mountain View, Calif.), Seshadri Ganguli (Sunnyvale, Calif.), Hua Chung (San Jose, Calif.) and See-Eng Phan (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the invention provide processes to selectively form a cobalt layer on a copper surface over exposed dielectric surfaces. In one embodiment, a method for capping a copper surface on a substrate is provided which includes positioning a substrate within a processing chamber,...