US Patent Issued to Applied Materials on Jan. 27 for "Integrated process sequence for hybrid bonding applications" (California, Montana Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,855, issued on Jan. 27, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Integrated process sequence for hybrid bonding applications" was invented by Niranjan Pingle (Milpitas, Calif.), Jitendra Ratilal Bhimjiyani (Santa Clara, Calif.) and Shreshtha Kumar Jaiswal (Kalispell, Mont.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for sequencing a hybrid bonding process by double linking a source of dies and a target. The method may include selecting a source of dies for bonding, selecting a target on which the dies will be bonded, linking the source to the target, linking the target to the source, forming an integrated bonding pr...