US Patent Issued to Applied Materials on Jan. 27 for "Fabricating dual damascene structures using multilayer photosensitive dielectrics" (New Hampshire, Massachusetts Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,778, issued on Jan. 27, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Fabricating dual damascene structures using multilayer photosensitive dielectrics" was invented by Benjamin D. Briggs (Merrimack, N.H.), William Charles (Winchester, Mass.) and Gillian Micale (Boston).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes obtaining a base structure including a stack of dielectric layers disposed on a substrate. The stack of dielectric layers includes a first photosensitive dielectric layer including a first photosensitive dielectric material sensitive to a first radiation dose, a second photosensitive dielectric layer inc...