US Patent Issued to Applied Materials on Jan. 27 for "Apparatus and methods for reducing substrate cool down time" (German Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,823, issued on Jan. 27, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Apparatus and methods for reducing substrate cool down time" was invented by Thomas Ackermann (Feichten, Germany) and Christian Hopfner (Dresden, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method and apparatus for reducing cool-down times within a cool-down chamber are described herein. The method and apparatus include a process chamber, a transfer chamber, a dual-handled transfer robot within the transfer chamber, and a cool-down chamber. The dual-handled transfer robot it utilized to transfer a substrate between the process chamber and the cool-dow...