US Patent Issued to Applied Materials on Jan. 13 for "Pad carrier assembly for horizontal pre-clean module" (California Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,521,841, issued on Jan. 13, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Pad carrier assembly for horizontal pre-clean module" was invented by Edward Golubovsky (San Jose, Calif.), Clinton Sakata (San Jose, Calif.), Jagan Rangarajan (San Jose, Calif.) and Ekaterina A. Mikhaylichenko (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pad carrier assembly that includes a coupling base and a pad carrier coupled to the coupling base, the coupling base and the pad carrier are configured to support a buffing pad by a mechanical clamping mechanism. Embodiments of the present disclosure will provide a method of supporting a buf...